Oxidation of ruthenium thin films using atomic oxygen

A. P. McCoy*, J. Bogan, A. Brady, G. Hughes

*Awdur cyfatebol y gwaith hwn

Allbwn ymchwil: Cyfraniad at gyfnodolynErthygladolygiad gan gymheiriaid

8 Dyfyniadau(SciVal)

Crynodeb

In this study, the use of atomic oxygen to oxidise ruthenium thin films is assessed. Atomic layer deposited (ALD) ruthenium thin films (∼ 3 nm) were exposed to varying amounts of atomic oxygen and the results were compared to the impact of exposures to molecular oxygen. X-ray photoelectron spectroscopy studies reveal substantial oxidation of metallic ruthenium films to RuO2 at exposures as low as ∼ 102 L at 575 K when atomic oxygen was used. Higher exposures of molecular oxygen resulted in no metal oxidation highlighting the benefits of using atomic oxygen to form RuO2. Additionally, the partial oxidation of these ruthenium films occurred at temperatures as low as 293 K (room temperature) in an atomic oxygen environment.

Iaith wreiddiolSaesneg
Tudalennau (o-i)112-116
Nifer y tudalennau5
CyfnodolynThin Solid Films
Cyfrol597
Dynodwyr Gwrthrych Digidol (DOIs)
StatwsCyhoeddwyd - 31 Rhag 2015
Cyhoeddwyd yn allanolIe

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