Electrodeposition behaviour and characterization of copper-zinc alloy in deep eutectic solvent

Xueliang Xie, Xingli Zou, Xionggang Lu, Qian Xu, Changyuan Lu, Chaoyi Chen, Zhongfu Zhou

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23 Citations (SciVal)


Cu–Zn alloy films have been electrodeposited directly from their oxide precursors in choline chloride (ChCl)/urea-based deep eutectic solvent (DES). The reaction mechanism and the influence of the cathodic potential on the characteristics of the Cu–Zn alloy films are studied. Cyclic voltammetry and energy dispersive spectroscopy analyses reveal that the reduction of Cu(II) species relatively more preferentially occurs in comparison with the reduction of Zn(II) species, and Cu–Zn codeposition process can be controlled in the DES. Chronoamperometric investigation further confirms that the electrodeposition of Cu–Zn alloy on a Fe electrode follows the three-dimensional instantaneous nucleation-growth process. The micro/nanostructured Cu–Zn alloy films with different phase compositions can be facilely produced by controlling the cathodic potential. The obtained Cu–Zn alloy films typically exhibit enhanced corrosion resistances in 3 wt% NaCl aqueous solution. It is suggested that Cu–Zn alloy films can be sustainably electrodeposited from their abundant and inexpensive oxide precursors in DES
Original languageEnglish
Pages (from-to)679-689
Number of pages11
JournalJournal of Applied Electrochemistry
Issue number6
Early online date25 Mar 2017
Publication statusPublished - 01 Jun 2017


  • electrodeposition
  • deep eutectic solvent
  • Cu-Zn alloy
  • oxides
  • nucleation-growth kinetics


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