Electrodeposition of Zn and Cu−Zn alloy from ZnO/CuO precursors in deep eutectic solvent

Xueliang Xie, Xingli Zou, Xionggang Lu, Changyuan Lu, Hongwei Cheng, Qian Xu, Zhongfu Zhou

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Abstract

The electrodeposition of Zn and Cu−Zn alloy has been investigated in choline chloride (ChCl)/urea (1:2 molar ratio) based deep eutectic solvent (DES). Cyclic voltammetry study demonstrates that the reduction of Zn(II) to Zn is a diffusion-controlled quasi-reversible, one-step, two electrons transfer process. Chronoamperometric investigation indicates that the electrodeposition of Zn on a Cu electrode typically involves three-dimensional instantaneous nucleation with diffusion-controlled growth process. Micro/nanostructured Zn films can be obtained by controlling the electrodeposition potential and temperature. The electrodeposited Zn crystals preferentially orient parallel to the (101) plane. The Zn films electrodeposited under more positive potentials and low temperatures exhibit improved corrosion resistance in 3 wt% NaCl solution. In addition, Cu–Zn alloy films have also been electrodeposited directly from CuO–ZnO precursors in ChCl/urea-based DES. The XRD analysis indicates that the phase composition of the electrodeposited Cu–Zn alloy depends on the electrodeposition potential
Original languageEnglish
Pages (from-to)481-489
Number of pages9
JournalApplied Surface Science
Volume385
Early online date27 May 2016
DOIs
Publication statusPublished - 01 Nov 2016

Keywords

  • electrodeposition
  • nucleation-growth kinetics
  • deep eutectic solvent
  • metal oxides
  • morphology

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