The dependence of the resolving power and sensitivity of a discrete electrode detector array on the proximity of a microchannel‐plate electron multiplier

A detector array has been designed which integrates all pulse sensing, data logging, control and interface circuitry on a single silicon chip. In conjunction with a microchannel‐plate electron multiplier (MCP) the array can be used to measure dispersed spectra of ions, electrons and photons (UV and higher energies). In order to increase the sensitivity of the pulse sensing circuitry, non‐standard steps are introduced into the fabrication process which increase cost and prototype development time. In the present work it is shown that by reducing the separation between the MCP output and the array to about 4.5 microns an improvement in performance is achieved which should enable the production of high performance devices using a standard fabrication process.